Table of Contents
Advertisement
RM-701
System Module
SIM interface
The phone has a SIM (Subscriber Identification Module) interface including a SIM connector.
The SIM interface consists of an internal interface between RAPU and EM ASIC (N2200), and an external
interface between EM ASIC and SIM contacts.
The SIM interface supports both 1.8V and 3.0V SIM cards. The SIM interface voltage is first 1.8 V when the SIM
card is inserted, and if the card does not response to the ATR (Answer to Request), 3V interface voltage is
used.
Device memory
The memory components of the device are internal COMBO POP4 4Gb DDR + 8Gb M3 (NAND) and a card reader
for MicroSD.
The MicroSD is used as a user's data storage memory. The µSD card is connected to RAPU via EM ASIC which
has an internal level shifter with an ESD protection filter.
BOB1.0M-b module
The BOB1.0M-b module provides full 802.11b, g & n WLAN, BT 2.1 + EDR, FM RDS and FM TX connectivity.
BOB is the name given to a generic technology release that combines WLAN, Bluetooth, FM Rx and FM TX radio
on a single monolithic IC. The phone uses BOB1.0M-b module that consists of a single chip transceiver WL1271,
plus a separate RF front end (FE) device. The BOB1.0M-b release operates in the 2.4GHz (ISM) and the
76-108MHz FM bands.
Issue 1
Figure 60 SIM interface
COMPANY CONFIDENTIAL
Copyright © 2011 Nokia. All rights reserved.
Page 6 – 13
Advertisement
Table of Contents
Troubleshooting
